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Chip Microphone
New MEMS microphone chip
Solid State System Co. Ltd [3S] developed its first single-chip design MEMS microphone and is set to kick off volume production at United Microelectronics Corporation (UMC) in the third quarter of 2009.
Blue Laser
OSRAM presents the smallest blue laser in its class
Osram Opto Semiconductors presents an optimized TO38 package which makes its new blue laser diode the perfect choice for tiny projectors that can be integrated into mobile devices such as cell phones and digital cameras.
The new laser diode has a wavelength of 450 nm, an output of 50 mW and an operating voltage of 5.5V.
Elpida goes China
Elpida-He Jian joint venture
Elpida Memory is going to build a 12-inch wafer fab in Suchou, China in cooperation with He Jian Technology.
But the planned Elpida-He Jian joint venture is not expected to start commercial operations until the first quarter of 2010, sources say.
Memory Market
Memory market rebounds
According to Taiwans IC substrate suppliers the memory market is showing signs of a rebound.
Major clients, including SanDisk, Samsung Electronics, Kingston Technology and Infineon increased their orders.
The SiP substrate segment will show a double-digit growth for 2008 the sources said.
Lead time already has extended from two to three weeks.
STMicroelectronics
Between three and five product families could go within the matter of months.
STMicroelectronics NV (Geneva, Switzerland) announced it would move on with the restructuring of its manufacturing activity and continue to divest product divisions, however, the number and names of product families in the hot seat remained undisclosed.
CoAir
UWB, Coax, Ethernet in a single chip
Sigma Designs has developed a second-generation ultrawideband chip set called CoAir for home networks that can simultaneously run UWB over wireless and coax at rates up to 370 Mbits/second while maintaining a Gbit Ethernet link.
Speakers-on-a-Chip
USB Speakers-on-a-Chip with Hardware Acoustic Echo Cancellation DSP
Conexant Systems presented the world’s first family of Speakers-on-a-Chip (SPoC) solutions that integrate the functionality of a digital/voice processor, audio Codec and Class-D amplifier in one cost-effective 48-pin Quad Flat-No Lead (QFN) package.
The chipset is optimized with stereo, high fidelity 24-bit DAC for music rendering, built-in echo-free speakerphone with wideband Acoustic Echo Cancellation (AEC) and a noise-reduction hardware Digital Signal Processor (DSP).
Multicore processors
Freescale Semiconductor is expanding its line of multicore embedded processors.
Freescale Semiconductor announced its new 45nm QorIQ family.
Two new dual-core chips consume less than 4 W, while a new eight-core part hits a new performance high in a chip consuming less than 30W.
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Product News
Thin-Film Micro-Energy Storage Devices
Thinergy - a Family of Micro-Energy Cells
Infinite Power Solutions, Inc, a maker of solid-state, rechargeable, thin-film micro-energy storage devices, has unveiled its Thinergy family of micro-energy cell (MEC) devices.
These MECs are ultra-thin, flexible and provide unrivaled rechargeability, cycle life and power performance. In many applications IPS's Thinergy devices can replace supercapacitors.
Illuminated SMD Switches
New RGB LED illuminated SMD switches
SHANPU CO. LTD., a specialist in manufacturing illuminated switches in Taiwan unveiled its new SPD range of illuminated tactile switches.
Illuminated SMD Switches
Solid State Batteries
Planar Energy Devices Inc.
The world's thinnest and safest high-capacity batteries
Planar Energy Devices Inc. is a privately held developer of tunable solid state power storage products for commercial and consumer applications. The company combines its family of proprietary solid state electrolyte materials with high-capacity electrode materials to create the world's thinnest and safest high-capacity batteries.
Planar Energy has battery solutions that span the capacity spectrum, from wireless sensors to RFID to portable device power.
For additional information please contact Planar Energy and read its presentation: Novel, Solid State Battery Structure Enables a Paradigm Shift in Sensor Deployment
Built-in 3.5G mobile module
3.5G mobile module supports Windows 7
Huawei Technologies Co., Ltd. (China) presented a built-in 3.5G mobile module that supports Microsoft's upcoming Windows 7 Operating System.
Huawei believes that the 3.5G modules will become a standard part of mobile Internet devices in the future. It is said that Asustek Computer will use Huawei's 3.5G mobile modules in its Eee PCs.
Fake NAND Flash
Fake NAND Flash spreading all over China
A large quantity of fake NAND flash is showing up in the China market with the bulk available as Samsung-branded chips.
Most of the fake products are packaged as finished products from branded vendors, but are found even without a die inside.
Solar-Cells
Spot pricing surges by over 10% in a month.
Spot pricing for solar cells has surged by over 10% in a month with a premium of almost 20% over contract quotes.
The upsurge is due to a rapid order pull-in from system maker wishing to enjoy the government incentives offered in Spain before the program expires.
The tight supply is expected to ease after September 2008.
SolarMagic
National Semiconductor enters photovoltaic market
National Semiconductor Corp. has entered the photovoltaic market with a new technology.
National says its SolarMagic technology extracts the maximum power efficiency of each photovoltaic panel, even when some panels in the array are compromised by shading, debris, or inherent panel-to-panel mismatch.
The new technology is a per-panel electronics solution that maximizes power output of multi-panel installations.
Intel goes SoC
Intel has announced its entry into the market for System-on-Chip integrated circuits.
Most of Intel's Soc will be based on the Atom processor, Intel's low-power processor aimed at portable applications.
The move markets a renewed attempt to enter mobile and communications markets by the world's largest chip company.
The company currently has 15 SoC projects in its pipeline, eight of them will be rolled out soon.
Intel sees large opportunities in mobile internet applications, such as location-based services, as well as connected in-car infotainment. In addition, the company said it plans to target industrial applications.
Organic Electroluminescence Panels
Japanese companies jointly established Lumiotec Inc.
A group headed by Mitsubishi Heavy Industries, Ltd. (MHI), ROHM CO., LTD., Toppan Printing Co., Ltd., and Mitsui & Co., Ltd., jointly established Lumiotec Inc. to assess the business viability of organic electroluminescence (OEL) panels for lighting applications. The joint venture plans to sell sample panels from the spring of 2009. A full-scale system for the commercial production and marketing of the panels will be set up once business viability of the panels is confirmed.
The establishment of Lumiotec Inc., which will actively promote the realization of the OEL panel business for lighting applications, was made possible by bringing together the technologies and resources of each of the founding companies of the joint venture. Specifically, through provision of the sample panels, the venture will pursue new applications for OEL panels and explore the potential for new demand in addition to replacing conventional lighting devices while accelerating enhancements of the panel's performance. Initially, the venture will focus primarily on the assessment of the OEL lighting panel business viability. The company is the first in the world dedicated to the OEL lighting panels business.
The OEL panel has advantageous features that neither conventional light sources, such as electric light bulbs and fluorescent tubes, nor light-emitting diodes (LED) provide, and therefore is expected to be a promising next generation lighting source.
At the time of writing Lumiotec Inc. didn't have a website.
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VIA Introduces the Nano Processor
Power Projection LEDs
New line of extremely powerful LEDs
Osram Opto Semiconductors introduced two new LEDs, OSTAR Compact and OSTAR Power Projection.
OSTAR Compact is designed for small, efficient systems in cell phones, PDAs and MP4 players.
The OSTAR Power Projection LED brings a new dimension to projection applications delivering high performance and low thermal resistance.
Heat Sinks
New line of extremely powerful heat sinks
Cool Innovations introduced a new line of extremely powerful flared pin fin heat sinks.
Cool Innovations claimes that the new heat sinks provide unparalleled cooling power due to a unique structure that was specifically optimized for natural convection environments.
SSD by Intel
A cost-effective storage solution
Intel NAND Products Group is introducing its latest solid-state drive product.
The Intel Z-P230 PATA Solid-State Drive (SSD) is a cost-effective storage solution designed to replace traditional hard disk drives in netbook and nettop systems.
It is four times smaller and lighter than a standard 1.8-inch hard disk drive and uses the same industry-standard PATA (IDE) connector.
The solid-state design eliminates all moving parts, making it more rugged and reliable for mobile designs. It also requires less power.
The Z-P230 PATA SSD will come in 4GB, 8GB and 16GB densities.
Price starts at $25 for the 4GB SSD (1'000-unit quantities).
SSD by Marvell
Marvell enters into the solid-state controller market
Marvell Technology Group Ltd. launched a family of NAND solid-state controllers.
The first product, dubbed the 88NV8120, is designed for use in solid-state drives in PCs and mobile systems.
The device is also designed for caching applications, as it supports Microsoft's ReadyBoot and ReadyDrive standards.
Marvell separately expanded its embedded processor line for consumer applications.
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